IC Decapsulation

Chemical and Laser Decapsulation

We serve package decap. for removing the plastic molding compound and exposing the silicon die, while keeping wires and other Cu or gold conductors intact to preserve chip function. We also can do die removal from a package. Chemical Etching Services Jet etching Manual cavity etching Total package removal Laser Decap. Services Molding compound removal…

FIB Circuit Edit

FIB Service

We provide Focused Ion Beam (FIB) circuit editing services for to help the customer optimize their IC design. Our advanced FEI-IET FIB system with Knights-Camelot software CAD navigation, we can obtain excellent resolution images of metal layers which helps to give a high yield rate of successful circuit edits.  FIB Service Circuit design analysis Circuit…

Innovation

New Technology of Front Side FIB

Following the trend of CSP type of IC design, we are proud of our innovative front side FIB technology developed especially for CSP, which resolves the limitations and bottlenecks of the conventional solution of FIB through the back side of the die that is commonly in use now. This unique technique enables us to remove…