We serve package decap. for removing the plastic molding compound and exposing the silicon die, while keeping wires and other Cu or gold conductors intact to preserve chip function. We also can do die removal from a package. Chemical Etching Services Jet etching Manual cavity etching Total package removal Laser Decap. Services Molding compound removal…
De-capsulation (Decap) is usually the 1st step to access a semiconductor device chip by etching a hole in the package over the die to expose it for visual microscope examination, FIB circuit edit, or failure analysis. Decap is done either by chemical etching or laser ablation methods. The decap process we use has been developed…
