De-capsulation (Decap) is usually the 1st step to access a semiconductor device chip by etching a hole in the package over the die to expose it for visual microscope examination, FIB circuit edit, or failure analysis.  Decap is done either by chemical etching or laser ablation  methods. The decap process we use has been developed and perfected  to keep the die, wire bonds and bond pads intact whether made of Cu or Al. Therefore in most cases, the overall functionality of the chip is retained.  This enables further failure analysis or reverse engineering.

Methods of decap usually depend upon customer requirements and the type of bond wires and metallization of the device.

Chemical decap: is typically used for Au or Al bonded package components. The package is dissolved with a pressurized stream of heated acids, directed thru a hole in a non-reactive special custom rubber gasket  The gasket is used to protect the rest of the package so the acid is only focused over the area of the IC package covering the die.

Laser decap: is typically used for Cu metallization or bonded plastic packaged components. This powerful laser tool is able to precisely open a hole over the die. This process usually maintains the decapped chip in electrically the same condition as before decap. The die is then exposed and available for FIB circuit editing or further process of failure analysis